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Updated: 25/03/2019 16:43, Counter: 322

A comprehensive cooperation agreement between Office of International Study Program and P&G Indochina concluded

The comprehensive cooperation agreement signing ceremony between Ho Chi Minh City University of Technology and P&G Indochina took place at Ho Chi Minh City University of Technology in the morning of 19/3/2019.

Attended the ceremony were Dr. Dang Dang Tung, Director of Office of International Study Program (OISP); Dr, Nguyen Le Dung, Vice Director of External Relations Office; Dr. Truong Quang Vinh and Dr. Nguyen Huynh Thong, Vice Directors of Office of International Study Program. Meanwhile, the counterpart from P&G Indochina consists of Director of the factory in Binh Duong Mr. Fernado Delrio, Head of HR Department in charge of product provision Mrs. Jenny Yeonardy, Head of HR Department of the factory in Binh Duong Mrs. Bui Kieu Anh.

OISP Director Dr. Dang Dang Tung giving an introduction about HCMUT as well as training and development strategy of the OISP Office

Four items included in the agreement consist of:

  • Paid internship and recruitments of top 15 students in IT and Engineering.
  • Scholarship offering for female engineers: 03 scholarship lots with the value of 15 million VND each as well as the fulltime job opportunities at P&G.
  • A leadership skill course for female engineers at OISP.
  • Seminars on Industry 4.0, Supply Chain Design, Key Technologies, Project Justification for students of OISP.

The Director of the factory in Binh Duong Mr. Fernando Delrio giving an introduction about P&G Indochina

P&G Indochina showed consent with leadership of OISP on highly qualified engineer training objectives for the future (i.e. these engineers are good at not only their expertise but also other useful skills, such as soft skills, leadership as well as fluent English proficiency making them ready to compete against others for jobs at corporations).

Agreement signing between Mr. Fernando Delrio (left) and Dr. Dang Dang Tung (right)

Signed agreement exchange

Token gift exchange by the end of the ceremony

Students will be provided with knowledge and useful skills at HCMUT compounded by empirical experiences in working environment at multinational corporations.

The agreement is effective from March 2019. P&G will attend OISP Job Fair 2019 on 30 March to seek for talented engineers at OISP. The participation registration can be found at: http://bit.ly/OISPJobFair2019.

OISP –HCMUT has been promoting collaborations with industry in a wide range of fields, such as Electrical and Electronics Engineering, Computer Science and Engineering, Mechanical Engineering, Civil Engineering, Petroleum, Cosmetics, Food Technology, Environmental Management and Engineering, Management Consulting and so on.  OISP plays as a bridge between University and Industry in recruitment, training, R&D and technology transfer in line with vision and mission of the university. 


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